Film Thickness Unevenness Analysis Device Outline This is an epoch-making non-contact film thickness evenness measurement device to measure the thickness of the surface coating and unevenness in the film thickness. This device radiates light on the measured object's surface, and captures the interference color produced by the phase difference of the reflected light from the film surface and from the board surface after penetrating the film due to the differences in the light path. A film thickness unevenness algorithm is used to analyze the image. Characteristics Concentration and color shade of the entire film captured by the color camera is measured as a two-dimensional image and the unevenness in thickness of the entire film is displayed numerically using a novel algorithm. This is in contrast to conventional brightness measurement methods that measure only a single point. As film thickness and unevenness of the entire film are measured and displayed numerically, instantly without contact, this device is appropriate for online measurement (100% inspection) of the coating process, as well as for inspection and quality control. Measurement resolution is from 100 to 10,000(Angstroms)   (calibration is needed). It is also applicable to thin film measurement in the semiconductor industry, for example in production of silicon wafers, not only ITO films, orientation films and various types of film when forming patterns. In-house inspection standards can be unified as this device can be calibrated with your boundary sample and there is little drift. The data measured and digitized with this device can be displayed as full-color images. Therefore, it may aid in further research and development of your database (brightness and color reference without deterioration). Original image Film thickness unevenness image Original image Film thickness unevenness image >>Return to LIST
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